Two full-fledged semiconductor fabrication plants are going to come up in India very soon entailing multi-billion dollar investment besides several chip assembly and packaging units, Minister of Electronics and IT Rajeev Chandrasekhar said.
In an interview with PTI, the minister confirmed that the two projects include a USD 8 billion proposal submitted by Israel-based Tower Semiconductors and the other from Tata Group.
“I am happy to share this with you and you are probably the first one I’m sharing this with. In the near term, two full-blown fabs are going to come up in India. These are going to be multi-billion-dollar fabs in the 65, 40 and 28-nanometer technology and there are going to be a host of other packaging proposals that we are evaluating,” Chandrasekhar said.
He was responding to a question on USD 8 billion investment proposal submitted by Tower Semiconductors and the status of India’s semiconductor roadmap.
The minister said that the project will be approved in the thi
In an interview with PTI, the minister confirmed that the two projects include a USD 8 billion proposal submitted by Israel-based Tower Semiconductors and the other from Tata Group.
“I am happy to share this with you and you are probably the first one I’m sharing this with. In the near term, two full-blown fabs are going to come up in India. These are going to be multi-billion-dollar fabs in the 65, 40 and 28-nanometer technology and there are going to be a host of other packaging proposals that we are evaluating,” Chandrasekhar said.
He was responding to a question on USD 8 billion investment proposal submitted by Tower Semiconductors and the status of India’s semiconductor roadmap.
The minister said that the project will be approved in the thi
